DocumentCode
783895
Title
Copper Direct Drilling With TEA 
Laser in Manufacture of High-Density Interconnection Printed Circuit Board
Author
Fang, Xiang Yi ; Yung, K.C.
Author_Institution
Sch. of Sci., Xian Jiaotong Univ., Xian City
Volume
29
Issue
3
fYear
2006
fDate
7/1/2006 12:00:00 AM
Firstpage
145
Lastpage
149
Abstract
A method for copper direct drilling by carbon dioxide (CO2 ) laser was investigated for efficient microvia formation on the copper conducting layer of high-density interconnection (HDI) of printed circuit board (PCB). A metal-tin layer was coated on the surface of copper conductor foil to enhance the CO2 laser energy adsorption on it. The coated surfaces were then drilled by a CO2 laser with various pulse energies. The microvia holes were efficiently formed in good quality with one laser pulse on 9-mum-thick polished copper conducting layer. The laser energy absorption of coated copper foils was approximately calculated. The experimental results demonstrated the potential application of the developed method in high-density interconnection printed circuit board manufacturing
Keywords
gas lasers; integrated circuit interconnections; laser beam machining; printed circuit manufacture; 9 micron; TEA CO2 laser; carbon dioxide laser; copper conducting layer; copper conductor foil; copper direct drilling; energy adsorption; high-density interconnection; laser drilling; metal-tin layer; microvia formation; microvia holes; printed circuit board manufacturing; Absorption; Carbon dioxide; Conductors; Copper; Drilling; Integrated circuit interconnections; Manufacturing; Optical pulses; Printed circuits; Surface emitting lasers; high-density interconnection; printed circuit board (PCB) manufacturing;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2006.882868
Filename
1707861
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