• DocumentCode
    784197
  • Title

    Thermal coupling in 2-finger heterojunction bipolar transistors

  • Author

    Liu, William

  • Author_Institution
    Corp. R&D, Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    42
  • Issue
    6
  • fYear
    1995
  • fDate
    6/1/1995 12:00:00 AM
  • Firstpage
    1033
  • Lastpage
    1038
  • Abstract
    We have previously analyzed the collapse phenomenon in heterojunction bipolar transistors (HBT´s) when the mutual couplings among the transistor fingers are negligible. In this investigation, we derive the collapse loci equations in 2-finger HBT´s in the presence of thermal coupling. It is found that the collapse loci equations are closely linked to a thermal instability condition best determined from the transistor regression characteristics. Unlike the previous derivation assuming zero thermal coupling, the collapse loci equations derived here are different depending on whether the HBT is driven by constant base current or constant base voltage bias
  • Keywords
    heterojunction bipolar transistors; thermal analysis; thermal resistance; thermal stability; 2-finger HBT; collapse loci equations; collapse phenomenon; constant base current; constant base voltage bias; heterojunction bipolar transistors; thermal coupling; thermal instability condition; transistor regression characteristics; Bipolar transistors; Equations; Fingers; Heterojunction bipolar transistors; Mutual coupling; Power amplifiers; Power generation; Temperature; Testing; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.387234
  • Filename
    387234