DocumentCode
784197
Title
Thermal coupling in 2-finger heterojunction bipolar transistors
Author
Liu, William
Author_Institution
Corp. R&D, Texas Instrum. Inc., Dallas, TX, USA
Volume
42
Issue
6
fYear
1995
fDate
6/1/1995 12:00:00 AM
Firstpage
1033
Lastpage
1038
Abstract
We have previously analyzed the collapse phenomenon in heterojunction bipolar transistors (HBT´s) when the mutual couplings among the transistor fingers are negligible. In this investigation, we derive the collapse loci equations in 2-finger HBT´s in the presence of thermal coupling. It is found that the collapse loci equations are closely linked to a thermal instability condition best determined from the transistor regression characteristics. Unlike the previous derivation assuming zero thermal coupling, the collapse loci equations derived here are different depending on whether the HBT is driven by constant base current or constant base voltage bias
Keywords
heterojunction bipolar transistors; thermal analysis; thermal resistance; thermal stability; 2-finger HBT; collapse loci equations; collapse phenomenon; constant base current; constant base voltage bias; heterojunction bipolar transistors; thermal coupling; thermal instability condition; transistor regression characteristics; Bipolar transistors; Equations; Fingers; Heterojunction bipolar transistors; Mutual coupling; Power amplifiers; Power generation; Temperature; Testing; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.387234
Filename
387234
Link To Document