Title :
A stress-free packaging solution for planar waveguide-based photonic components
Author :
Zhang, Zhiyi ; Xiao, Gao Zhi ; Liu, Jiaren
Author_Institution :
Photonic Syst. Group, Nat. Res. Council Canada, Ottawa, Ont., Canada
fDate :
5/1/2005 12:00:00 AM
Abstract :
It is a challenge to simultaneously prevent the fiber ribbons from internal stress in the planar waveguide-based components and protect the ribbons from external stress. We have achieved this by simply incorporating two soft elastomer gaskets into each conventional packaging to compensate the mismatched thermal expansion between the fiber ribbon and packaging case, and fastening the fiber ribbon to the case to transfer their external load away. The involved process was easily implemented at a minimum cost, and the packaged variable optical attenuators and arrayed waveguide gratings were free of internal ribbon stress and able to meet the fiber-handling requirement as specified by Telcordia GR 1209 test.
Keywords :
arrayed waveguide gratings; elastomers; internal stresses; optical attenuators; optical fibres; optical planar waveguides; packaging; thermal expansion; arrayed waveguide gratings; elastomer gaskets; fiber ribbons; internal stress; mismatched thermal expansion compensation; packaging; planar waveguide; variable optical attenuators; Arrayed waveguide gratings; Internal stresses; Optical arrays; Optical fiber testing; Optical waveguides; Packaging; Planar waveguides; Protection; Thermal stresses; Waveguide components; Arrayed waveguide grating (AWG); fiber ribbons; packaging; planar waveguides; stress; variable optical attenuator (VOA);
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2005.845682