DocumentCode
785807
Title
Research of material properties reliance for numerical analysis
Author
Nakanishi, Tohru
Author_Institution
IBM, Kyoto
Volume
54
Issue
2
fYear
2008
fDate
5/1/2008 12:00:00 AM
Firstpage
609
Lastpage
613
Abstract
The material properties that we use in the numerical analysis, controls the quality of the analysis result directly. The best choice to use the correct properties is that we measure them by ourselves. However, it is sometimes difficult to get them by ourselves because of the problem such as expense, equipment or time. In this paper, the reliance of the material properties used in the numerical analysis for the reliability assessment of POP (package on package) is studied, especially focusing the encapsulant. The result of the numerical analysis with the material properties, that the material supplier announced, did not support the result of the actual hardware testing. Then through the research process, we had focused the material properties, and then we actually measured the material properties with the piece of the actual hardware parts which are constructing this product. As the result, we found the order difference between the material suppliers announced data and our measured data. It is recognized strongly that the reliance of the material properties is extremely important. With this established numerical model, we had studied the optimized parameter of the encapsulant.
Keywords
electronics packaging; materials properties; numerical analysis; reliability; hardware testing; material properties; numerical analysis; package on package; reliability assessment; Digital cameras; Electrical products industry; Hardware; Material properties; Materials reliability; Materials testing; Numerical analysis; Numerical models; Packaging machines; Performance evaluation;
fLanguage
English
Journal_Title
Consumer Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0098-3063
Type
jour
DOI
10.1109/TCE.2008.4560137
Filename
4560137
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