Title :
Ultra-low-power design
Author :
Rabaey, J. ; Ammer, J. ; Otis, B. ; Burghardt, F. ; Chee, Y.H. ; Pletcher, N. ; Sheets, M. ; Qin, H.
Abstract :
In this article, we describe how such an integrated approach has indeed made it possible to produce a PicoNode that meets the original goals. The resulting node combines innovative technologies, such as radio-frequency microelectromechanical systems (RF-MEMS) with ultra-low-power RF and digital integrated circuit (IC) design, and employs aggressive energy-scavenging and packaging techniques. For these technological advances to come to their full fruition, they must be complemented by novel opportunistic networking and wireless protocol schemes that virtually eliminate standby power while still providing robustness
Keywords :
integrated circuit design; low-power electronics; radiofrequency integrated circuits; wireless sensor networks; PicoNode project; RF integrated circuit design; RF-MEMS; ambient intelligence; digital integrated circuit design; energy-scavenging; packaging techniques; ultra low power design; wireless sensor networks; Batteries; Capacitors; Ceramics; Coupling circuits; Energy storage; Packaging; Photovoltaic cells; Prototypes; Transistors; Voltage;
Journal_Title :
Circuits and Devices Magazine, IEEE
DOI :
10.1109/MCD.2006.1708372
