• DocumentCode
    786169
  • Title

    Mechanics of microcantilever beams subject to combined electrostatic and adhesive forces

  • Author

    Knapp, James A. ; De Boer, Maarten P.

  • Author_Institution
    Dept. 1111, Sandia Nat. Labs., Albuquerque, NM, USA
  • Volume
    11
  • Issue
    6
  • fYear
    2002
  • fDate
    12/1/2002 12:00:00 AM
  • Firstpage
    754
  • Lastpage
    764
  • Abstract
    One of the most important issues facing the continued development and application of microelectromechanical systems (MEMS) is that of adhesion and friction between microstructures intended to transfer force. In this work, we develop modeling approaches for studying adhesion (i.e., stiction) using the observed shape of microcantilevers under electrostatic loading. Analytical models for an idealized configuration are presented first. The solutions reveal the regimes over which the cantilever deflections are sensitive to adhesion versus applied loading. Also, the energy release rate and hence the cantilever adhesion value is shown to be independent of the curvature of the initially freestanding beam. Second, with a finite-element modeling approach, we quantify the slight sensitivity of the cantilever deflections to the surface force law assumed and show that with Angstrom scale resolution of beam deflections, cohesive zone law information can in principle be deduced. We also use this approach to model the nonuniform electrostatic loading force used in our experiments and the effect of support post compliance. We then demonstrate how adhesion values are obtained along the length of a microcantilever.
  • Keywords
    adhesion; finite element analysis; micromechanical devices; stiction; adhesion; analytical model; cantilever deflection; cohesive zone law; electrostatic loading; energy release rate; finite element model; friction; microcantilever beam; microelectromechanical system; stiction; support post compliance; surface force law; Adhesives; Analytical models; Electrostatics; Finite element methods; Friction; Microelectromechanical systems; Micromechanical devices; Microstructure; Shape; Structural beams;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.805047
  • Filename
    1097796