DocumentCode :
786224
Title :
Electronics Insulation
Author :
Sato, F.
Author_Institution :
Mitsubishi Electric Corporation Amagasaki, Hyogo Japan
Issue :
6
fYear :
1986
Firstpage :
981
Lastpage :
987
Abstract :
Modern design for electronic devices and electronic parts continuously requires various new technologies in order to fabricate them in a smaller space. Here, we review development of printed circuit boards, hybrid IC, monolithic IC´s and flyback transformers for TV sets. Recent improvement of dielectric materials and processing techniques has enabled smaller size, higher density integration, and better performance.
Keywords :
Conducting materials; Copper; Dielectric materials; Dielectrics and electrical insulation; Hybrid integrated circuits; Laminates; Nonhomogeneous media; Power transformer insulation; Printed circuits; Space technology;
fLanguage :
English
Journal_Title :
Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9367
Type :
jour
DOI :
10.1109/TEI.1986.349012
Filename :
4157098
Link To Document :
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