DocumentCode :
787430
Title :
A power-optimal repeater insertion methodology for global interconnects in nanometer designs
Author :
Banerjee, Kaustav ; Mehrotra, Amit
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Volume :
49
Issue :
11
fYear :
2002
fDate :
11/1/2002 12:00:00 AM
Firstpage :
2001
Lastpage :
2007
Abstract :
This paper addresses the problem of power dissipation during the buffer insertion phase of interconnect performance optimization. It is shown that the interconnect delay is actually very shallow with respect to both the repeater size and separation close to the minimum point. A methodology is developed to calculate the repeater size and interconnect length which minimizes the total interconnect power dissipation for any given delay penalty. This methodology is used to calculate the power-optimal buffering schemes for various ITRS technology nodes for 5% delay penalty. Furthermore, this methodology is also used to quantify the relative importance of the various components of the power dissipation for power-optimal solutions for various technology nodes.
Keywords :
CMOS integrated circuits; VLSI; buffer circuits; circuit optimisation; delays; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; low-power electronics; repeaters; CMOS; ITRS technology nodes; VLSI; buffer insertion phase; delay penalty; global interconnects; interconnect length; interconnect performance optimization; low-power design; nanometer designs; power dissipation; power modeling; power-optimal buffering schemes; power-optimal repeater insertion methodology; repeater size; separation; Capacitance; Delay; Design optimization; Integrated circuit interconnections; Integrated circuit technology; Large scale integration; Power dissipation; Repeaters; Silicon; Very large scale integration;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2002.804706
Filename :
1097918
Link To Document :
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