• DocumentCode
    787641
  • Title

    Boron retarded diffusion in the presence of indium or germanium

  • Author

    Li, Hong-Jyh ; Kirichenko, Taras A. ; Kohli, Puneet ; Banerjee, Sanjay K. ; Graetz, Eric ; Tichy, Robin ; Zeitzoff, Peter

  • Author_Institution
    Microelectron. Res. Center, Texas Univ., Austin, TX, USA
  • Volume
    23
  • Issue
    11
  • fYear
    2002
  • Firstpage
    646
  • Lastpage
    648
  • Abstract
    Experimental results of germanium (Ge) and indium (In) preamorphization by ion-implantation show that the diffusion of boron (B) is retarded by the presence of Ge or In and that this retardation is more important than the preamorphization (dechanneling) effect. Result shows that In retards B diffusion more than Ge and the retardation effect due to In becomes greater with increasing retained dose of In. Larger In doses cause larger strain, which results in more B being tied up in immobile clusters near the surface. In order to achieve adequate retained dose of In, the implanted dose of In must be increased to 5/spl times/10/sup 15/ cm/sup -2/. After anneal, the junction depth (at 10/sup 18/ cm/sup -3/) is reduced from 628 /spl Aring/ in the control wafer (no In co-implant) to 480 /spl Aring/.
  • Keywords
    boron; diffusion; doping profiles; elemental semiconductors; germanium; indium; ion implantation; rapid thermal annealing; semiconductor technology; silicon; 480 A; B retarded diffusion; Ge preamorphization; In implanted dose; In preamorphization; RTA; Si:B,Ge; Si:B,In; immobile clusters; junction depth; rapid thermal annealing; retardation effect; semiconductor device ion implantation; Bonding; Boron; Capacitive sensors; Etching; Germanium; Indium; Manufacturing processes; Rapid thermal annealing; Rapid thermal processing; Semiconductor devices;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2002.805005
  • Filename
    1097940