DocumentCode
787641
Title
Boron retarded diffusion in the presence of indium or germanium
Author
Li, Hong-Jyh ; Kirichenko, Taras A. ; Kohli, Puneet ; Banerjee, Sanjay K. ; Graetz, Eric ; Tichy, Robin ; Zeitzoff, Peter
Author_Institution
Microelectron. Res. Center, Texas Univ., Austin, TX, USA
Volume
23
Issue
11
fYear
2002
Firstpage
646
Lastpage
648
Abstract
Experimental results of germanium (Ge) and indium (In) preamorphization by ion-implantation show that the diffusion of boron (B) is retarded by the presence of Ge or In and that this retardation is more important than the preamorphization (dechanneling) effect. Result shows that In retards B diffusion more than Ge and the retardation effect due to In becomes greater with increasing retained dose of In. Larger In doses cause larger strain, which results in more B being tied up in immobile clusters near the surface. In order to achieve adequate retained dose of In, the implanted dose of In must be increased to 5/spl times/10/sup 15/ cm/sup -2/. After anneal, the junction depth (at 10/sup 18/ cm/sup -3/) is reduced from 628 /spl Aring/ in the control wafer (no In co-implant) to 480 /spl Aring/.
Keywords
boron; diffusion; doping profiles; elemental semiconductors; germanium; indium; ion implantation; rapid thermal annealing; semiconductor technology; silicon; 480 A; B retarded diffusion; Ge preamorphization; In implanted dose; In preamorphization; RTA; Si:B,Ge; Si:B,In; immobile clusters; junction depth; rapid thermal annealing; retardation effect; semiconductor device ion implantation; Bonding; Boron; Capacitive sensors; Etching; Germanium; Indium; Manufacturing processes; Rapid thermal annealing; Rapid thermal processing; Semiconductor devices;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2002.805005
Filename
1097940
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