• DocumentCode
    787718
  • Title

    Impact of the trapping of anode hot holes on silicon dioxide breakdown

  • Author

    Vogel, Eric M. ; Heh, Da-Wei ; Bernstein, Joseph B. ; Suehle, John S.

  • Author_Institution
    Div. of Semicond. Electron., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
  • Volume
    23
  • Issue
    11
  • fYear
    2002
  • Firstpage
    667
  • Lastpage
    669
  • Abstract
    Hot holes are injected from the anode and trapped in thin silicon dioxide using constant voltage stress at large gate voltage. By comparing oxides having trapped holes with oxides in which the holes were detrapped, it is shown that the presence of trapped holes does not affect the breakdown of the oxide. Furthermore, as the temperature during stress is increased, less hole trapping is observed whereas the charge-to-breakdown of the oxide is decreased. The results show that although the trapping of hot holes injected using anode hole injection (AHI) may be partly responsible for defect generation in silicon dioxide, breakdown cannot be limited by the number of holes trapped in the oxide.
  • Keywords
    MOS capacitors; MOSFET; dielectric thin films; hole traps; hot carriers; semiconductor device breakdown; semiconductor device reliability; silicon compounds; CMOS devices; SiO/sub 2/-Si; TDDB; anode hole injection; anode hot holes; charge-to-breakdown; constant voltage stress; defect generation; hole trapping; hot hole injection; oxide. breakdown; reliability; thin oxide breakdown; time-dependent dielectric breakdown; trapped holes; Anodes; Breakdown voltage; Dielectric breakdown; Electric breakdown; Electron traps; Hot carriers; Hydrogen; NIST; Silicon compounds; Stress;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2002.805004
  • Filename
    1097947