DocumentCode
787718
Title
Impact of the trapping of anode hot holes on silicon dioxide breakdown
Author
Vogel, Eric M. ; Heh, Da-Wei ; Bernstein, Joseph B. ; Suehle, John S.
Author_Institution
Div. of Semicond. Electron., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Volume
23
Issue
11
fYear
2002
Firstpage
667
Lastpage
669
Abstract
Hot holes are injected from the anode and trapped in thin silicon dioxide using constant voltage stress at large gate voltage. By comparing oxides having trapped holes with oxides in which the holes were detrapped, it is shown that the presence of trapped holes does not affect the breakdown of the oxide. Furthermore, as the temperature during stress is increased, less hole trapping is observed whereas the charge-to-breakdown of the oxide is decreased. The results show that although the trapping of hot holes injected using anode hole injection (AHI) may be partly responsible for defect generation in silicon dioxide, breakdown cannot be limited by the number of holes trapped in the oxide.
Keywords
MOS capacitors; MOSFET; dielectric thin films; hole traps; hot carriers; semiconductor device breakdown; semiconductor device reliability; silicon compounds; CMOS devices; SiO/sub 2/-Si; TDDB; anode hole injection; anode hot holes; charge-to-breakdown; constant voltage stress; defect generation; hole trapping; hot hole injection; oxide. breakdown; reliability; thin oxide breakdown; time-dependent dielectric breakdown; trapped holes; Anodes; Breakdown voltage; Dielectric breakdown; Electric breakdown; Electron traps; Hot carriers; Hydrogen; NIST; Silicon compounds; Stress;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2002.805004
Filename
1097947
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