• DocumentCode
    787873
  • Title

    13th International Symposium on the Physical and Failure Analysis of Integrated Circuits

  • Volume
    5
  • Issue
    4
  • fYear
    2005
  • Firstpage
    737
  • Lastpage
    737
  • Abstract
    Describes the above-named upcoming conference event. May include topics to be covered or calls for papers.
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2005.863982
  • Filename
    1573692
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=787873