• DocumentCode
    78801
  • Title

    Charge Quantity Influence on Resistance Switching Characteristic During Forming Process

  • Author

    Chu, Tian-Jian ; Chang, Ting-Chang ; Tsai, Tsung-Ming ; Wu, Hung-Hsien ; Chen, Jau-Horng ; Chang, Kuo-Chu ; Young, Tai-Fa ; Chen, Ke-Horng ; Syu, Yong-En ; Chang, Geng-Wei ; Chang, Yi-Feng ; Chen, M.-C. ; Lou, Jyun-Hao ; Pan, Jhih-Hong ; Chen, Jen-Yin ; T

  • Author_Institution
    Department of Materials and Optoelectronic Science, National Sun Yat-Sen University, Kaohsiung, Taiwan
  • Volume
    34
  • Issue
    4
  • fYear
    2013
  • fDate
    Apr-13
  • Firstpage
    502
  • Lastpage
    504
  • Abstract
    In this letter, we presented that the charge quantity is the critical factor for forming process. Forming is a pivotal process in resistance random access memory to activate the resistance switching behavior. However, overforming would lead to device damage. In general, the overshoot current has been considered as a degradation reason during the forming process. In this letter, the quantity of charge through the switching layer has been proven as the key element in the formation of the conduction path. Ultrafast pulse forming can form a discontinuous conduction path to reduce the operation power.
  • Keywords
    Educational institutions; Electrodes; Hafnium compounds; Resistance; Silicon; Switches; Tin; Forming process; hafnium oxide $( hbox{HfO}_{2})$; nonvolatile memory; resistance switching;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2242843
  • Filename
    6473822