DocumentCode
78801
Title
Charge Quantity Influence on Resistance Switching Characteristic During Forming Process
Author
Chu, Tian-Jian ; Chang, Ting-Chang ; Tsai, Tsung-Ming ; Wu, Hung-Hsien ; Chen, Jau-Horng ; Chang, Kuo-Chu ; Young, Tai-Fa ; Chen, Ke-Horng ; Syu, Yong-En ; Chang, Geng-Wei ; Chang, Yi-Feng ; Chen, M.-C. ; Lou, Jyun-Hao ; Pan, Jhih-Hong ; Chen, Jen-Yin ; T
Author_Institution
Department of Materials and Optoelectronic Science, National Sun Yat-Sen University, Kaohsiung, Taiwan
Volume
34
Issue
4
fYear
2013
fDate
Apr-13
Firstpage
502
Lastpage
504
Abstract
In this letter, we presented that the charge quantity is the critical factor for forming process. Forming is a pivotal process in resistance random access memory to activate the resistance switching behavior. However, overforming would lead to device damage. In general, the overshoot current has been considered as a degradation reason during the forming process. In this letter, the quantity of charge through the switching layer has been proven as the key element in the formation of the conduction path. Ultrafast pulse forming can form a discontinuous conduction path to reduce the operation power.
Keywords
Educational institutions; Electrodes; Hafnium compounds; Resistance; Silicon; Switches; Tin; Forming process; hafnium oxide $( hbox{HfO}_{2})$ ; nonvolatile memory; resistance switching;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2013.2242843
Filename
6473822
Link To Document