• DocumentCode
    788106
  • Title

    A High-Performance Aperture-Coupled Patch Antenna Supported by a Micromachined Polymer Ring

  • Author

    Pavuluri, S.K. ; Wang, C.H. ; Sangster, A.J.

  • Author_Institution
    Sch. of Eng. & Phys. Sci., Heriot-Watt Univ., Edinburgh
  • Volume
    7
  • fYear
    2008
  • fDate
    6/30/1905 12:00:00 AM
  • Firstpage
    283
  • Lastpage
    286
  • Abstract
    An aperture-coupled high-gain microstrip patch antenna with wide bandwidth is reported. The slot-coupled antenna device was produced on a microwave PCB substrate with a suspended patch supported by a micromachined polymer ring structure. After the fabrication of the microstrip feed line and the coupling slot on the substrate and the patch on a polyimide film, two polymer rings of identical design were deposited on the microwave and the polyimide substrates respectively using a SU8 epoxy resin and the photolithography technique. The two polymer rings were then aligned and bonded together to obtain a suspended patch antenna for high-gain operation. The resultant height of the SU8 ring and hence the gap between the polymer and the microwave substrates was 1.5 mm. Reflection and radiation measurements were carried out to evaluate the performance of the antenna device. The results show that the device has a gain of 8.3 dBi at ~12 GHz and a -10 dB bandwidth of ~2.5 GHz or 19%. The simulated results are demonstrated to be in good agreement with measurement. The predicted efficiency of the device is about 98%.
  • Keywords
    antenna feeds; aperture-coupled antennas; microstrip antennas; microstrip lines; photolithography; slot antennas; aperture-coupled high-gain microstrip patch antenna; micromachined polymer ring; microstrip feed line; microwave PCB substrate; photolithography technique; polyimide substrates; slot-coupled antenna device; Aperture coupling; microassembly; micromachining; microwave antennas;
  • fLanguage
    English
  • Journal_Title
    Antennas and Wireless Propagation Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1536-1225
  • Type

    jour

  • DOI
    10.1109/LAWP.2008.928468
  • Filename
    4563289