Title :
Influence of grain size on the transport properties of Ni80 Fe20 and Cu thin films
Author :
Rijks, Th.G.S.M. ; Sour, R.L.H. ; Neerinck, D.G. ; De Veirman, A.E.M. ; Coehoorn, R. ; Kools, J.C.S. ; Gillies, M.F. ; de Jonge, W.J.M.
fDate :
11/1/1995 12:00:00 AM
Abstract :
The conductivity of sputtered Ta/Cu/Ta and Ta/Ni80Fe 20/Ta thin films was measured for a film thickness ranging from 20 to 1500 Å. The measured data were analyzed using a semi-classical model for the electron transport, that includes grain boundary scattering, It was found that in these films grain boundaries are an important source of electron scattering, in Ni80Fe20 leading to an effective spin dependence of the scattering which is considerably. Smaller than the intrinsic spin dependence of the scattering
Keywords :
copper; electrical conductivity; electron mobility; ferromagnetic materials; grain boundaries; grain size; iron alloys; magnetic multilayers; magnetic particles; magnetoresistance; metallic superlattices; nickel alloys; sputtered coatings; tantalum; 20 to 1500 A; Ta-Cu-Ta; Ta-Ni80Fe20-Ta; Ta/Cu/Ta thin films; Ta/Ni80Fe20/Ta thin films; conductivity; electron scattering; electron transport; film thickness; grain boundary scattering; grain size; spin dependent scattering; sputtered films; Conductive films; Conductivity measurement; Data analysis; Electrons; Grain boundaries; Grain size; Iron; Scattering; Sputtering; Thickness measurement;
Journal_Title :
Magnetics, IEEE Transactions on
