Title :
The Multidimensional Phase Unwrapping Integral and Applications to Microwave Tomographical Image Reconstruction
Author :
Fang, Qianqian ; Meaney, Paul M. ; Paulsen, Keith D.
Author_Institution :
Thayer Sch. of Eng., Dartmouth Coll., Hanover, NH
Abstract :
Spatial unwrapping of the phase component of time varying electromagnetic fields has important implications in a range of disciplines including synthetic aperture radar (SAR) interferometry, MRI, optical confocal microscopy, and microwave tomography. This paper presents a fundamental framework based on the phase unwrapping integral, especially in the complex case where phase singularities are enclosed within the closed path integral. With respect to the phase unwrapping required when utilized in Gauss-Newton iterative microwave image reconstruction, the concept of dynamic phase unwrapping is introduced where the singularity location varies as a function of the iteratively modified property distributions. Strategies for dynamic phase unwrapping in the microwave problem were developed and successfully tested in simulations and clinical experiments utilizing large, high contrast targets to validate the approach
Keywords :
Newton method; computerised tomography; electromagnetic fields; image reconstruction; medical image processing; Gauss-Newton iterative microwave image reconstruction; MRI; closed path integral; dynamic phase unwrapping; iteratively modified property distributions; microwave tomographical image reconstruction; multidimensional phase unwrapping integral; optical confocal microscopy; phase singularities; singularity location; spatial unwrapping; synthetic aperture radar interferometry; time varying electromagnetic fields; Adaptive optics; Electromagnetic fields; Image reconstruction; Laser radar; Magnetic resonance imaging; Multidimensional systems; Optical devices; Optical interferometry; Optical microscopy; Synthetic aperture radar; Microwave imaging; phase singularity; phase unwrapping; scattering null;
Journal_Title :
Image Processing, IEEE Transactions on
DOI :
10.1109/TIP.2006.881999