Title :
Flip chip assembled MEMS inductors
Author :
Zeng, J. ; Pang, A.J. ; Wang, C.H. ; Sangster, A.J.
Author_Institution :
Sch. of Eng. & Phys. Sci., Heriot-Watt Univ., Edinburgh, UK
fDate :
4/14/2005 12:00:00 AM
Abstract :
High performance suspended MEMS inductors produced using a flip chip assembly approach are described. An inductor structure is fabricated on a carrier and then flip chip assembled onto a substrate to form a suspended inductor for RF-IC applications with significant improvement in Q-factor and frequency of operation over the conventional IC inductors. A spiral MEMS inductor has been successfully produced on a silicon substrate with an air gap of 26 μm between the inductor structure and the substrate. The inductance of the device was measured to be ∼2 nH and a maximum Q-factor of 19 at ∼2.5 GHz was obtained after pad/connector de-embedding.
Keywords :
air gaps; flip-chip devices; inductors; micromechanical devices; radiofrequency integrated circuits; silicon; Q-factor; RF-IC applications; air gap; flip chip assembled MEMS inductors; high performance suspended MEMS inductors; pad-connector deembedding; silicon substrate; spiral MEMS inductor;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20050153
