Application of ECT technique for inspection of bare PCB

Author

Yamada, S. ; Nakamura, K. ; Iwahara, M. ; Taniguchi, T. ; Wakiwaka, H.

Author_Institution

Kanazawa Univ., Japan

Volume

39

Issue

5

fYear

2003

Firstpage

3325

Lastpage

3327

Abstract

The detection of imperfections (such as disconnections, chipping cracks, nonuniformity in thickness and short-circuits) on the traces of a bare printed circuit board (PCB) using a new high-sensitive eddy-current testing (ECT) probe is reported in this paper. The ECT technique is composed of a planar meander type exciting coil and a new multiple solenoid sensing coil. An image processing method is used to analyze the results. This paper discusses the structure of the new probe and the characteristics of the measurement technique to inspect high-density PCBs with narrow conductor-width. The possibility of detecting micro-metal balls is explored.

Keywords

coils; eddy current testing; flaw detection; image processing; inspection; printed circuit testing; bare printed circuit board inspection; chipping cracks; disconnections; eddy-current testing technique; high-sensitive eddy-current testing probe; image processing method; imperfection detection; micro-metal ball detection; multiple solenoid sensing coil; narrow conductor-width; planar meander type exciting coil; thickness nonuniformity; Circuit testing; Coils; Electrical capacitance tomography; Image analysis; Image processing; Inspection; Measurement techniques; Printed circuits; Probes; Solenoids;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/TMAG.2003.816765

Filename

1233386