• DocumentCode
    790914
  • Title

    Electrooptic planar deflector switches with thin-film PLZT active elements

  • Author

    Glebov, Alexei L. ; Lee, Michael G. ; Huang, Lidu ; Aoki, Shigenori ; Yokouchi, Kishio ; Ishii, Masatoshi ; Kato, Masayuki

  • Author_Institution
    Fujitsu Labs. of America Inc., Sunnyvale, CA, USA
  • Volume
    11
  • Issue
    2
  • fYear
    2005
  • Firstpage
    422
  • Lastpage
    430
  • Abstract
    First prototypes of electrooptic (EO) planar deflector switches (PDSs) are fabricated with hybrid integration on Si substrates. Planar optical modules, made in silica-on-silicon technology, consist of input and output (I/O) waveguide microlenses facing each other and slab waveguides in between. The modules interconnect the I/O fibers with laterally collimated light beams less than 400 μm in width at distances up to 100 mm with losses lower than 3 dB. Thin lead lanthanum zirconium titanate (PLZT) films with prism-shaped electrodes grown on SrTiO3 substrates form the deflector elements. The PLZT films are more than 10 μm thick with EO coefficients about 40 pm/V. The deflector assembly technology provides chip vertical positioning accuracy better than 1 μm. The deflector chips are attached to the optical substrates with thermo-compression flip-chip bonding. The optical power losses of the modules with test silica chips can be as low as 3.6 dB. However, the lowest module losses achieved with PLZT are about 10 dB. The channel-to-channel switching operations are demonstrated at about 40 V and switching times less than 500 ns.
  • Keywords
    assembling; electro-optical switches; electrodes; ferroelectric thin films; flip-chip devices; integrated optics; integrated optoelectronics; lanthanum compounds; lead compounds; microlenses; optical communication equipment; optical deflectors; optical fabrication; optical interconnections; optical waveguides; silicon; silicon compounds; 10 dB; 100 mm; 3.6 dB; 40 V; 400 mum; I/O fibers; PLZT films; PbLaZrO3TiO3; Si; Si substrates; SiO2-Si; SrTiO3; SrTiO3 substrates; channel-to-channel switching; chip vertical positioning accuracy; deflector assembly; deflector chips; electrooptic switches; ferroelectric films; flip-chip bonding; hybrid integration; input waveguide microlenses; laterally collimated light beams; module losses; optical interconnects; optical power losses; optical substrates; output waveguide microlenses; planar deflector switches; planar optical modules; prism-shaped electrodes; silica-on-silicon technology; slab waveguides; test silica chips; thermocompression bonding; thin-film active elements; Electrooptic deflectors; Electrooptical waveguides; Optical films; Optical losses; Optical planar waveguides; Optical switches; Optical waveguides; Planar waveguides; Substrates; Transistors; Ferroelectric films; optical planar waveguides; optical switches; optoelectronic integrated circuits; photonic devices;
  • fLanguage
    English
  • Journal_Title
    Selected Topics in Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    1077-260X
  • Type

    jour

  • DOI
    10.1109/JSTQE.2005.846515
  • Filename
    1425479