Title :
Molded hybrid IC packages
Author :
Biswas, Ranjit ; Curtis, Hazer ; Deane, Philip A. ; Marinis, Thomas F.
Author_Institution :
AT&T Bell Lab., North Andover, MA, USA
fDate :
12/1/1989 12:00:00 AM
Abstract :
A family of plastic molded packages that conform to JEDEC standards for hybrid IC applications is being developed by providing a number of benefits. System design is simplified because standard CAD (computer-aided design) libraries can be utilized to determine part location, routing, solder pad dimensions, and electrical characteristics of the package. Manufacturability is improved because industry standard equipment can be used for electrical testing, component placement, solder reflow, cleaning, and inspection. Overall system reliability is improved because circuit boards can be manufactured using standardized components, equipment, and processes that are better characterized and controlled. The mechanical reliability of QUAD packages with 68 and 124 leads on 50-mil pitch and 132 leads on 25-mil pitch has been investigated. Results indicate that all three of these molded packages can withstand several hundred temperature cycles from -40°C to 130°C without any degradation of their mechanical integrity
Keywords :
hybrid integrated circuits; packaging; reliability; standards; surface mount technology; -40 to 130 C; 25 mil; 50 mil; JEDEC standards; QUAD packages; cleaning; component placement; electrical testing; industry standard equipment; inspection; mechanical integrity; plastic molded packages; solder reflow; standardized components; system reliability; temperature cycles; Application software; Application specific integrated circuits; Design automation; Hybrid integrated circuits; Integrated circuit packaging; Lead; Libraries; Packaging machines; Plastic integrated circuit packaging; Standards development;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
