• DocumentCode
    792155
  • Title

    A simple finite-difference frequency-domain (FDFD) algorithm for analysis of switching noise in printed circuit boards and packages

  • Author

    Ramahi, Omar M. ; Subramanian, Vinay ; Archambeault, Bruce

  • Author_Institution
    Mech. Eng. Dept., Univ. of Maryland, College Park, MD, USA
  • Volume
    26
  • Issue
    2
  • fYear
    2003
  • fDate
    5/1/2003 12:00:00 AM
  • Firstpage
    191
  • Lastpage
    198
  • Abstract
    Simultaneous switching noise (SSN) compromises the integrity of the power distribution structure on multilayer printed circuit boards (PCB). Several methods have been used to investigate SSN. These methods ranged from simple lumped circuit models to full-wave (dynamic) three-dimensional Maxwell equations simulators. In this work, we present an efficient and simple finite-difference frequency-domain (FDFD) based algorithm that can simulate, with high accuracy, the capacity of a PCB board to introduce SSN. The FDFD code developed here also allows for simulation of real-world decoupling capacitors that are typically used to mitigate SSN effects at sub 1 GHz frequencies. Furthermore, the algorithm is capable of including lumped circuit elements having user-specified complex impedance. Numerical results are presented for several test boards and packages, with and without decoupling capacitors. Validation of the FDFD code is demonstrated through comparison with other algorithms and laboratory measurements.
  • Keywords
    circuit noise; finite difference methods; frequency-domain analysis; packaging; printed circuits; decoupling capacitor; electronic package; finite-difference frequency-domain algorithm; lumped circuit element; multilayer printed circuit board; numerical simulation; power distribution structure; simultaneous switching noise; Algorithm design and analysis; Capacitors; Circuit noise; Circuit simulation; Finite difference methods; Frequency domain analysis; Packaging; Power distribution; Printed circuits; Switching circuits;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2003.817477
  • Filename
    1233579