DocumentCode :
792528
Title :
Calculation of self and mutual impedances in planar magnetic structures
Author :
Hurley, W.G. ; Duffy, M.C.
Author_Institution :
Dept. of Electron. Eng., Univ. Coll. Galway, Ireland
Volume :
31
Issue :
4
fYear :
1995
fDate :
7/1/1995 12:00:00 AM
Firstpage :
2416
Lastpage :
2422
Abstract :
The high frequency operation of magnetic components, in applications such as filters, makes them ideal candidates for thick film technology along with resistors and capacitors. This in turn leads to distinct advantages over labor intensive wire wound components: improved reliability, repeatability, accuracy and consequential cost reductions. This paper establishes a new set of formulas for the self and mutual impedances of planar coils on ferromagnetic substrates. A planar coil in air is a special case of the generalized formulas. The formulas are derived directly from Maxwell´s equations and therefore serve as a useful yardstick for simpler approximations. The formulas take full account of the current density distribution in the coil cross-section and the eddy current losses in the substrate. Experimental and calculated impedances up to 100 MHz are presented for a four layer device with three turns per layer which is 150 μm thick and 40 mm2 in area
Keywords :
Maxwell equations; coils; current distribution; eddy current losses; electric impedance; inductance; magnetic multilayers; magnetic thin film devices; 100 MHz; 150 mum; Maxwell equations; coil cross-section; current density distribution; eddy current losses; ferromagnetic substrates; filters; four layer device; high frequency operation; lumped parameter model; mutual impedance; planar coils; planar magnetic structures; self impedance; spiral coils; thick film technology; Capacitors; Coils; Filters; Frequency; Impedance; Magnetic separation; Resistors; Substrates; Thick films; Wire;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.390151
Filename :
390151
Link To Document :
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