DocumentCode :
792667
Title :
New insights in polarity-dependent oxide breakdown for ultrathin gate oxide
Author :
Wu, Ernest ; Suñé, Jordi
Author_Institution :
IBM Microelectron. Div., Essex Junction, VT, USA
Volume :
23
Issue :
8
fYear :
2002
Firstpage :
494
Lastpage :
496
Abstract :
In this work, a quantitative analysis is applied to resolve the newly reported polarity-dependent charge-to-breakdown (Q/sub BD/) data from thick oxides of 6.8 nm down to ultrathin oxides of 1.9 nm. Three independent sets of Q/sub BD/ data, i.e., n/sup +/poly/NFET stressed under inversion and accumulation, and p/sup +/ poly/PFET under accumulation are carefully investigated. The Q/sub BD/ degradation observed for p-type anodes, either poly-Si or Si-substrate, can be nicely understood with the framework of maximum energy released by injected electrons. Thus, this work provides a universal and quantitative account for a variety of experimental observations in the time-to-breakdown (T/sub BD/) and Q/sub BD/ polarity-dependence of oxide breakdown.
Keywords :
MOSFET; accumulation layers; inversion layers; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; tunnelling; 1.9 nm; Poisson equations; accumulation; ballistic direct tunneling; charge-to-breakdown; dispersive Fowler-Nordheim injection conditions; injected electrons; inversion; maximum energy released; p-type anodes; polarity-dependent oxide breakdown; semiconductor device reliability; time-to-breakdown; ultrathin gate oxide; Anodes; Breakdown voltage; Degradation; Dielectric devices; Dielectric substrates; Electric breakdown; Electrons; Semiconductor device reliability; Stress; Tunneling;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2002.801293
Filename :
1021104
Link To Document :
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