DocumentCode :
792867
Title :
Addressing packaging challenges
Author :
Adam, Joseph ; Chang, Chi Shih ; Stankus, John J. ; Iyer, Mahadevan K. ; Chen, William T.
Author_Institution :
Conexant Syst. Inc., Newport Beach, CA, USA
Volume :
18
Issue :
4
fYear :
2002
fDate :
7/1/2002 12:00:00 AM
Firstpage :
40
Lastpage :
49
Abstract :
To meet the emerging near-term and long-term packaging challenges, the electronics industry must begin to increase spending on packaging research and technology development. In the short-term the industry shift to manufacturing outsourcing (combined with decreased profitability in many electronics sectors) has driven a decrease in packaging research. The market forces will correct this trend as the impact of increasing package cost and the limits of packaging technology start to constrain industry growth. However, a short-term gap will develop in broad-based industry packaging capability for emerging technologies and new applications. This gap will create an opportunity for significant competitive advantage through packaging for those companies that increase their focus on packaging development today.
Keywords :
ageing; electronics industry; packaging; reliability; electronics industry; manufacturing outsourcing; package cost; packaging challenges; packaging research; packaging technology; technology development; Adhesives; Assembly; Cost function; Dielectric liquids; Dielectric losses; Dielectric substrates; Packaging; Signal analysis; Silicon; Transient analysis;
fLanguage :
English
Journal_Title :
Circuits and Devices Magazine, IEEE
Publisher :
ieee
ISSN :
8755-3996
Type :
jour
DOI :
10.1109/MCD.2002.1021121
Filename :
1021121
Link To Document :
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