Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection applications for the optoelectronic technology consortium (OETC)

Author

Wong, Yiu-Man ; Muehlner, Dirk J. ; Faudskar, C.C. ; Buchholz, D. Bruce ; Fishteyn, Mikhail ; Brandner, James L. ; Parzygnat, W.J. ; Morgan, Robert A. ; Mullally, Theodore ; Leibenguth, R.E. ; Guth, Gregory D. ; Focht, Marlin W. ; Glogovsky, Kenneth G. ;

Author_Institution

AT&T Bell Labs., Murray Hill, NJ, USA

Volume

13

Issue

6

fYear

1995

fDate

6/1/1995 12:00:00 AM

Firstpage

995

Lastpage

1016

Abstract

A parallel, 32-channel, high density (140 μm pitch), 500 Mb/s NRZ, point-to-point, optical data link has been fabricated using existing GaAs IC, silicon optical bench (SiOB), and multichip module (MCM-D) technologies. The main components of the transmitter and the receiver modules are a GaAs-based vertical cavity surface emitting laser (VCSEL) array at 850 mn with its IC driver array chip and an integrated metal-semiconductor-metal (MSM) receiver (photodetector and signal processing circuits) array at 850 nm. The package module uses a modified 164 I/O JEDEC premolded plastic quad flat pack (PQFP) in combination with a polymer film integrated circuit (POLYFIC) chip carrier. The electrical input and output are 500 Mb/s NRZ binary signals. The optical I/O in both modules consists of a directly-connectorized (nonpigtail) fiber array block that plugs into the 32×1 optical fiber ribbon directly on one side and accepts 32 optical signals from the SEL array or delivers them to the MSM receiver array via a gold-coated 45° polished fiber array mirror. The MACII-32 ribbon cable is an enhanced version of the standard MACII connector ribbon cable. This paper characterizes key components of the optical data link, describes its package design, and discusses preliminary component and optical data link test results

Keywords

integrated circuit packaging; integrated optoelectronics; metal-semiconductor-metal structures; mirrors; multichip modules; optical fibre couplers; optical fibre networks; optical interconnections; optical receivers; optical transmitters; photodetectors; semiconductor lasers; surface emitting lasers; 140 mum; 16 Gbit/s; GaAs; GaAs IC; GaAs-based vertical cavity surface emitting laser; IC driver array chip; Si; VCSEL array; chip carrier; electrical input; electrical output; high-density; integrated metal-semiconductor-metal receiver; multichip module; optical data link; optical fiber ribbon; optical interconnection applications; optical signals; optoelectronic technology consortium; photodetector; plastic quad flat pack; polymer film integrated circuit; receiver modules; signal processing circuits; silicon optical bench; transmitter modules; Optical arrays; Optical devices; Optical fiber cables; Optical films; Optical receivers; Optical signal processing; Optical transmitters; Packaging; Stimulated emission; Vertical cavity surface emitting lasers;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/50.390217

Filename

390217