Title :
Bi-directional optical backplane bus for general purpose multi-processor board-to-board optoelectronic interconnects
Author :
Natarajan, Srikanth ; Zhao, Chunhe ; Chen, Ray T.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fDate :
6/1/1995 12:00:00 AM
Abstract :
We report for the first time a bidirectional optical backplane bus for a high performance system containing nine multi-chip module (MCM) boards, operating at 632.8 and 1300 nm. The backplane bus reported here employs arrays of multiplexed polymer-based waveguide holograms in conjunction with a waveguiding plate, within which 16 substrate guided waves for 72 (8×9) cascaded fanouts, are generated. Data transfer of 1.2 Gbt/s at 1.3-μm wavelength is demonstrated for a single bus line with 72 cascaded fanouts. Packaging-related issues such as transceiver size and misalignment are embarked upon to provide a reliable system with a wide bandwidth coverage. Theoretical treatment to minimize intensity fluctuations among the nine modules in both directions is further presented and an optimum design rule is provided. The backplane bus demonstrated, is for general-purpose and therefore compatible with such IEEE standardized buses as VMEbus, Futurebus and FASTBUS, and can function as a backplane bus in existing computing environments
Keywords :
Fastbus; holography; multiplexing; multiprocessor interconnection networks; optical computing; optical interconnections; optical planar waveguides; packaging; system buses; transceivers; 1.2 Gbit/s; 1300 nm; 632.8 nm; FASTBUS; Futurebus; IEEE standardized buses; VMEbus; backplane bus; bi-directional optical backplane bus; cascaded fanouts; data transfer; high performance system; intensity fluctuations; multi-chip module boards; multi-processor board-to-board optoelectronic interconnects; multiplexed polymer-based waveguide holograms; optimum design rule; packaging-related issues; reliable system; single bus line; substrate guided waves; transceiver misalignment; transceiver size; waveguiding plate; wide bandwidth coverage; Backplanes; Bandwidth; Bidirectional control; Clocks; Integrated circuit interconnections; Optical interconnections; Optical waveguides; Signal processing; Transceivers; Wire;
Journal_Title :
Lightwave Technology, Journal of