DocumentCode
793653
Title
Approaches to electronic miniaturization
Author
Bird, H.M.B.
Author_Institution
Eng. Res. Centre, AT&T Bell Labs., Princeton, NJ, USA
Volume
18
Issue
2
fYear
1995
fDate
6/1/1995 12:00:00 AM
Firstpage
274
Lastpage
278
Abstract
Over the past few years, dramatic progress has been made in miniaturizing electronics products. This has been driven by many forces, the chief of which have been increasing integration at the integrated-circuit chip level and competitiveness in the consumer marketplace. This paper examines elements that lead to effective miniaturization, including components, materials, and manufacturing processes. Specific examples are presented, including the “smart card,” wireless headsets, and the PCMCIA modem
Keywords
electronic equipment manufacture; integrated circuit manufacture; lead bonding; microassembling; modems; packaging; smart cards; PCMCIA modem; components; electronic miniaturization; integrated circuits; manufacturing processes; materials; smart card; wireless headsets; Birds; Cameras; Consumer electronics; Cost function; Humans; Integrated circuit interconnections; Manufacturing processes; Modems; Space technology; Telephony;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.390303
Filename
390303
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