Title :
Approaches to electronic miniaturization
Author_Institution :
Eng. Res. Centre, AT&T Bell Labs., Princeton, NJ, USA
fDate :
6/1/1995 12:00:00 AM
Abstract :
Over the past few years, dramatic progress has been made in miniaturizing electronics products. This has been driven by many forces, the chief of which have been increasing integration at the integrated-circuit chip level and competitiveness in the consumer marketplace. This paper examines elements that lead to effective miniaturization, including components, materials, and manufacturing processes. Specific examples are presented, including the “smart card,” wireless headsets, and the PCMCIA modem
Keywords :
electronic equipment manufacture; integrated circuit manufacture; lead bonding; microassembling; modems; packaging; smart cards; PCMCIA modem; components; electronic miniaturization; integrated circuits; manufacturing processes; materials; smart card; wireless headsets; Birds; Cameras; Consumer electronics; Cost function; Humans; Integrated circuit interconnections; Manufacturing processes; Modems; Space technology; Telephony;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
