DocumentCode :
793697
Title :
The impact of technology scaling on ESD robustness and protection circuit design
Author :
Amerasekera, Ajith ; Duvvury, Charvaka
Author_Institution :
Semicond. Process & Device Center, Texas Instrum. Inc., Dallas, TX, USA
Volume :
18
Issue :
2
fYear :
1995
fDate :
6/1/1995 12:00:00 AM
Firstpage :
314
Lastpage :
320
Abstract :
The trends in ESD robustness as a function of technology scaling, for feature sizes down to 0.25 μm, have been experimentally determined using single finger nMOS transistors and full ESD protection circuits. It is shown that as feature sizes are reduced, good ESD performance can be obtained provided the negative effects of the shallower junctions are offset by the positive effects of the reduction in the effective channel lengths. Hence, processes and protection circuits with feature sizes as small as 0.25 μm can be developed without degrading ESD robustness
Keywords :
CMOS integrated circuits; electrostatic discharge; failure analysis; integrated circuit reliability; integrated circuit technology; protection; 0.25 micron; CMOS circuits; ESD robustness; effective channel lengths; feature sizes; negative effects; protection circuit design; shallower junctions; single finger nMOS transistors; technology scaling; Area measurement; BiCMOS integrated circuits; CMOS technology; Circuit synthesis; Degradation; Electrostatic discharge; MOSFETs; Protection; Robustness; Semiconductor device measurement;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/95.390309
Filename :
390309
Link To Document :
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