• DocumentCode
    793697
  • Title

    The impact of technology scaling on ESD robustness and protection circuit design

  • Author

    Amerasekera, Ajith ; Duvvury, Charvaka

  • Author_Institution
    Semicond. Process & Device Center, Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    18
  • Issue
    2
  • fYear
    1995
  • fDate
    6/1/1995 12:00:00 AM
  • Firstpage
    314
  • Lastpage
    320
  • Abstract
    The trends in ESD robustness as a function of technology scaling, for feature sizes down to 0.25 μm, have been experimentally determined using single finger nMOS transistors and full ESD protection circuits. It is shown that as feature sizes are reduced, good ESD performance can be obtained provided the negative effects of the shallower junctions are offset by the positive effects of the reduction in the effective channel lengths. Hence, processes and protection circuits with feature sizes as small as 0.25 μm can be developed without degrading ESD robustness
  • Keywords
    CMOS integrated circuits; electrostatic discharge; failure analysis; integrated circuit reliability; integrated circuit technology; protection; 0.25 micron; CMOS circuits; ESD robustness; effective channel lengths; feature sizes; negative effects; protection circuit design; shallower junctions; single finger nMOS transistors; technology scaling; Area measurement; BiCMOS integrated circuits; CMOS technology; Circuit synthesis; Degradation; Electrostatic discharge; MOSFETs; Protection; Robustness; Semiconductor device measurement;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.390309
  • Filename
    390309