Title :
High-temperature electronics - a role for wide bandgap semiconductors?
Author :
Neudeck, Philip G. ; Okojie, Robert S. ; Chen, Liang-Yu
Author_Institution :
NASA Glenn Res. Center, Cleveland, OH, USA
fDate :
6/1/2002 12:00:00 AM
Abstract :
The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300°C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog VLSI in this temperature range. However practical operation of silicon power devices at ambient temperatures above 200°C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.
Keywords :
VLSI; high-temperature electronics; integrated circuit packaging; silicon compounds; wide band gap semiconductors; 200 to 300 degC; SiC; VLSI; ambient temperatures; contacts; electronic subsystems; high-power operation; high-temperature electronics; internal junction temperatures; material growth; packaging; self-heating; wide bandgap semiconductors; Aerospace electronics; Aerospace industry; Aircraft; Connectors; Photonic band gap; Silicon carbide; System performance; Temperature sensors; Wide band gap semiconductors; Wiring;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/JPROC.2002.1021571