Title :
A new multichip module using a copper polyimide multilayer substrate
Author :
Sasaki, Shinichi ; Kon, Taichi ; Ohsaki, Takaaki ; Yasuda, Toyoshi
Author_Institution :
NTT Appl. Electron. Lab., Tokyo, Japan
fDate :
12/1/1989 12:00:00 AM
Abstract :
A new multichip module using a multilayer substrate with a polyimide dielectric and a fine pattern of copper conductors is presented. This substrate contains small copper columnar vias which reduce the thermal resistance of polyimide layers without causing a channel accommodation decrease, and thin-film resistors for terminated transmission. This module can densely mount high-speed LSI chips that produce twice as much heat as those in conventional modules. Furthermore, this module can transmit high-speed pulses at over 2 Gb/s
Keywords :
large scale integration; modules; packaging; thin film resistors; 2 Gbit/s; Cu; Cu polyimide multilayer substrate; channel accommodation decrease; copper columnar vias; fine copper conductor pattern; high-speed LSI chips; high-speed pulses; multichip module; polyimide dielectric; terminated transmission; thermal resistance; thin-film resistors; Conductors; Copper; Dielectric substrates; Dielectric thin films; Large scale integration; Multichip modules; Nonhomogeneous media; Polyimides; Resistors; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
