DocumentCode
794270
Title
Temperature dependence modeling for MOS VLSI circuit simulation
Author
Wan, Chung-Ping ; Sheu, Bing J.
Author_Institution
Inf. Sci. Inst., Univ of Southern California, Los Angeles, CA, USA
Volume
8
Issue
10
fYear
1989
fDate
10/1/1989 12:00:00 AM
Firstpage
1065
Lastpage
1073
Abstract
An accurate and efficient temperature modeling methodology for the semiempirical BSIM (Berkeley short-channel IGFET model) has been developed for MOS VLSI circuit simulation. A sensitive model parameter subset which has large effects on transistor output characteristics is determined from the sensitivity analysis. Updating of model parameter values for this sensitive subset is performed prior to circuit simulation at each given temperature. For a 1.2 μm CMOS process, the sensitive subset for temperature effects consists of only eight out of the 67 BSIM parameters. Circuit simulation using this sensitive subset approach to predict temperature effects has shown good agreement with experimental data on transistor output characteristics, inverter transfer characteristics, and oscillation frequency of a 31-stage ring oscillator
Keywords
MOS integrated circuits; VLSI; circuit analysis computing; semiconductor device models; sensitivity analysis; temperature; 1.2 micron; Berkeley short-channel IGFET model; CMOS process; MOS VLSI; circuit simulation; sensitive model parameter subset; sensitivity analysis; temperature dependence; temperature modeling methodology; transistor output characteristics; CMOS process; Circuit simulation; Frequency; Inverters; Ring oscillators; Semiconductor device modeling; Sensitivity analysis; Temperature dependence; Temperature sensors; Very large scale integration;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/43.39068
Filename
39068
Link To Document