Title :
Effect of temperature on electrical conduction of carbon-black-filled polyimide
Author_Institution :
Dept. of Electr. Eng., Tufts Univ., Medford, MA, USA
fDate :
12/1/1989 12:00:00 AM
Abstract :
A study of the stability of two types of carbon resistive paste based on polyimide is reported. Experiments on electrical properties of these thick-film resistors at elevated temperatures are recorded, and the electrical conduction mechanism in thick-film resistors is demonstrated. The conduction mechanism follows closely the model proposed by V. Ambegoekar et al. (1971), while the curing mechanism agrees well with that suggested by N.F. Mott and E.A. Davis (1971). Some of the observed phenomena have been explained on the basis of disordered solids that have many carriers with low electron mobility. The apparently anomalous temperature coefficient of resistance versus temperature behavior finds an immediate explanation in the disordered-system model
Keywords :
electrical conductivity of solids; filled polymers; thick film resistors; C resistive paste; anomalous temperature coefficient; carbon-black-filled polyimide; curing mechanism; disordered solids; disordered-system model; electrical conduction; low electron mobility carriers; thick-film resistors; Curing; Lattices; Manufacturing; Mechanical factors; Pigmentation; Polyimides; Resistors; Solids; Stability; Temperature dependence;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on