Title :
&thetas;jc characterization of chip packages-justification, limitations, and future
Author :
Bar-Cohen, Avaram ; Elperin, Tov ; Eliasi, Rami
Author_Institution :
Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA
fDate :
12/1/1989 12:00:00 AM
Abstract :
It is noted that there has been increased use of θjc for the thermal characterization of chip packages. The longevity of θjc can be traced to its simplicity, its utility as a figure of merit, and its convenient use in numerical analysis of packaging configurations. To enhance the utility of this parameter, the distinct contribution of various segments of the `case´ area to the junction temperature is recognized, and this dependence is embodied in a modified-θjc relation. The analytical basis and methodology to be used in obtaining this relation are presented and illustrated by the use of detailed chip package temperatures obtained from numerical analysis of a generic PLCC (plastic leaded clip carrier) package
Keywords :
cooling; integrated circuit technology; packaging; thermal analysis; thermal resistance; &thetas;jc characterization; &thetas;jc longevity; PLCC; PLCC package; case area segments; chip package temperatures; chip packages; figure of merit; junction temperature; junction to case thermal resistance; limitations; numerical analysis; packaging configurations; plastic leaded clip carrier; thermal characterization; CMOS logic circuits; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Numerical analysis; Out of order; Temperature; Thermal management; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
