DocumentCode
794734
Title
&thetas;jc characterization of chip packages-justification, limitations, and future
Author
Bar-Cohen, Avaram ; Elperin, Tov ; Eliasi, Rami
Author_Institution
Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA
Volume
12
Issue
4
fYear
1989
fDate
12/1/1989 12:00:00 AM
Firstpage
724
Lastpage
731
Abstract
It is noted that there has been increased use of θjc for the thermal characterization of chip packages. The longevity of θjc can be traced to its simplicity, its utility as a figure of merit, and its convenient use in numerical analysis of packaging configurations. To enhance the utility of this parameter, the distinct contribution of various segments of the `case´ area to the junction temperature is recognized, and this dependence is embodied in a modified-θjc relation. The analytical basis and methodology to be used in obtaining this relation are presented and illustrated by the use of detailed chip package temperatures obtained from numerical analysis of a generic PLCC (plastic leaded clip carrier) package
Keywords
cooling; integrated circuit technology; packaging; thermal analysis; thermal resistance; &thetas;jc characterization; &thetas;jc longevity; PLCC; PLCC package; case area segments; chip package temperatures; chip packages; figure of merit; junction temperature; junction to case thermal resistance; limitations; numerical analysis; packaging configurations; plastic leaded clip carrier; thermal characterization; CMOS logic circuits; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Numerical analysis; Out of order; Temperature; Thermal management; Thermal resistance;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.49039
Filename
49039
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