Title :
Nonlinear thermal behavior of a plastic leaded chip carrier package
Author :
Di Barba, Paolo ; Savini, Antonio
Author_Institution :
Dept. of Electr. Eng., Pavia Univ., Italy
fDate :
12/1/1989 12:00:00 AM
Abstract :
A finite-element simulation of the steady-state thermal field in a freely suspended plastic package of the plastic leaded chip carrier type is presented. Numerical results are reported and compared with the corresponding experimental ones. The nonlinear dependence of thermal resistance on dissipated power is shown
Keywords :
cooling; finite element analysis; packaging; thermal resistance; PLCC; dissipated power; finite-element simulation; nonlinear thermal behaviour; numerical results; plastic leaded chip carrier package; steady-state thermal field; thermal resistance; Circuits; Cooling; Heat transfer; Lead; Manufacturing; Plastic packaging; Prototypes; Steady-state; Thermal conductivity; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
