Title :
Surface-mount plastic packages-an assessment of their thermal performance
Author :
Mahalingam, Mali
Author_Institution :
Motorola Inc., Phoenix, AZ, USA
fDate :
12/1/1989 12:00:00 AM
Abstract :
The characteristics of surface mount (SM) plastic packages such as SOICs (small outline ICs) PLCCs (plastic leaded chip carriers), and FPPLCCs (fine pitch PLCCs) used in IC packaging are described. Experimental data are reported on single-component packages in free air, forced air, and liquid immersion cooling environments. Parameters of a model to help a system thermal designer to best utilize the single-component thermal data are discussed. The influence of both the package variables (such as leadframe design, chip size, and heat spreader) and user variables (such as PC board material, board level package density, and cooling mode) on the package thermal performance is assessed. Opportunities to enhance the SM plastic packages´ thermal performance are identified, and their prospects are assessed
Keywords :
VLSI; integrated circuit technology; packaging; surface mount technology; thermal resistance; FPPLCCs; IC packaging; PC board material; PLCCs; PQFP; SM; SMT; SOICs; assessment; board level package density; chip size; cooling mode; fine pitch PLCCs; forced air cooling environment; free air cooling environment; heat spreader; leadframe design; liquid immersion cooling environments; package thermal performance; plastic leaded chip carriers; plastic quad flat packs; single-component packages; single-component thermal data; small outline ICs; surface mount plastic packages; system thermal designer; thermal performance; Cooling; Integrated circuit packaging; Logic arrays; Materials testing; Plastic integrated circuit packaging; Plastic packaging; Samarium; Thermal factors; Thermal management; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
