A New Sputtering Target for Perpendicular Media Continuous Fabrication and Resultant Properties

A new sputtering source target was proposed for use in high-rate deposition of double-layer perpendicular media. The target consisted of Permalloy plate walls which were perpendicular to the substrate and functioned as part of a magnetic circuit for plasma confinement. The discharge characteristics of the target were very well suited to low-pressure, high-power sputtering at a low discharge voltage. The Permalloy films obtained with this target had a broader region of uniform thickness and much stronger adhesion to polyimide substrate than did films prepared using a conventional GT target.