• DocumentCode
    79660
  • Title

    Power Module and Cooling System Thermal Performance Evaluation for HEV Application

  • Author

    Puqi Ning ; Zhenxian Liang ; Wang, F.

  • Author_Institution
    Power Electron. & Electr. Machinery Group, Oak Ridge Nat. Lab., Oak Ridge, TN, USA
  • Volume
    2
  • Issue
    3
  • fYear
    2014
  • fDate
    Sept. 2014
  • Firstpage
    487
  • Lastpage
    495
  • Abstract
    To further reduce system costs and package volumes of hybrid electric vehicles, it is important to optimize the power module and associated cooling system. This paper reports the thermal performance evaluation and analysis of three commercial power modules and a proposed planar module with different cooling system. Results show that power electronics can be better merged with the mechanical environment. Experiments and simulations were conducted to help further optimization.
  • Keywords
    cooling; hybrid electric vehicles; modules; power electronics; HEV application; cooling system; hybrid electric vehicles; mechanical environment; planar module; power electronics; power module; thermal performance evaluation; Cooling; Insulated gate bipolar transistors; Multichip modules; Temperature measurement; Temperature sensors; Thermal resistance; Electric vehicles; semiconductor device packaging;
  • fLanguage
    English
  • Journal_Title
    Emerging and Selected Topics in Power Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    2168-6777
  • Type

    jour

  • DOI
    10.1109/JESTPE.2014.2303143
  • Filename
    6727409