DocumentCode
79660
Title
Power Module and Cooling System Thermal Performance Evaluation for HEV Application
Author
Puqi Ning ; Zhenxian Liang ; Wang, F.
Author_Institution
Power Electron. & Electr. Machinery Group, Oak Ridge Nat. Lab., Oak Ridge, TN, USA
Volume
2
Issue
3
fYear
2014
fDate
Sept. 2014
Firstpage
487
Lastpage
495
Abstract
To further reduce system costs and package volumes of hybrid electric vehicles, it is important to optimize the power module and associated cooling system. This paper reports the thermal performance evaluation and analysis of three commercial power modules and a proposed planar module with different cooling system. Results show that power electronics can be better merged with the mechanical environment. Experiments and simulations were conducted to help further optimization.
Keywords
cooling; hybrid electric vehicles; modules; power electronics; HEV application; cooling system; hybrid electric vehicles; mechanical environment; planar module; power electronics; power module; thermal performance evaluation; Cooling; Insulated gate bipolar transistors; Multichip modules; Temperature measurement; Temperature sensors; Thermal resistance; Electric vehicles; semiconductor device packaging;
fLanguage
English
Journal_Title
Emerging and Selected Topics in Power Electronics, IEEE Journal of
Publisher
ieee
ISSN
2168-6777
Type
jour
DOI
10.1109/JESTPE.2014.2303143
Filename
6727409
Link To Document