• DocumentCode
    796958
  • Title

    Mechanical and dielectric assessment of ultrahigh molecular weight polyethylene insulation for cryogenic applications

  • Author

    Weihan, Wu ; Fengnian, Hao

  • Author_Institution
    Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
  • Volume
    27
  • Issue
    3
  • fYear
    1992
  • fDate
    6/1/1992 12:00:00 AM
  • Firstpage
    504
  • Lastpage
    512
  • Abstract
    In order to test the feasibility of applying ultrahigh molecular weight polyethylene (UHMW PE) as the electrical insulation at cryogenic temperatures, mechanical and dielectric assessment was carried out. In particular, the stress cracking resistance and treeing resistance of UHMW PE at 77 K were tested in comparison with those of crosslinked polyethylene (XLPE) and low density polyethylene (LDPE). The test result and theoretical analysis show that mechanical forces play a dominant role both in stress cracking of LDPE and XLPE, and in electrical treeing at low temperature. UHMW PE with extreme stress cracking resistance is recommended as an appropriate candidate for electrical insulation at low temperature
  • Keywords
    cryogenics; dielectric properties of solids; electric breakdown of solids; insulation testing; organic insulating materials; polymer films; thermal stress cracking; 77 K; cryogenic temperatures; dielectric assessment; mechanical assessment; stress cracking resistance; treeing resistance; ultrahigh molecular weight polyethylene insulation; Cable insulation; Cryogenics; Dielectrics and electrical insulation; Electric resistance; Insulation testing; Polyethylene; Polymers; Stress; Temperature; Trees - insulation;
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9367
  • Type

    jour

  • DOI
    10.1109/14.142713
  • Filename
    142713