DocumentCode :
796958
Title :
Mechanical and dielectric assessment of ultrahigh molecular weight polyethylene insulation for cryogenic applications
Author :
Weihan, Wu ; Fengnian, Hao
Author_Institution :
Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
Volume :
27
Issue :
3
fYear :
1992
fDate :
6/1/1992 12:00:00 AM
Firstpage :
504
Lastpage :
512
Abstract :
In order to test the feasibility of applying ultrahigh molecular weight polyethylene (UHMW PE) as the electrical insulation at cryogenic temperatures, mechanical and dielectric assessment was carried out. In particular, the stress cracking resistance and treeing resistance of UHMW PE at 77 K were tested in comparison with those of crosslinked polyethylene (XLPE) and low density polyethylene (LDPE). The test result and theoretical analysis show that mechanical forces play a dominant role both in stress cracking of LDPE and XLPE, and in electrical treeing at low temperature. UHMW PE with extreme stress cracking resistance is recommended as an appropriate candidate for electrical insulation at low temperature
Keywords :
cryogenics; dielectric properties of solids; electric breakdown of solids; insulation testing; organic insulating materials; polymer films; thermal stress cracking; 77 K; cryogenic temperatures; dielectric assessment; mechanical assessment; stress cracking resistance; treeing resistance; ultrahigh molecular weight polyethylene insulation; Cable insulation; Cryogenics; Dielectrics and electrical insulation; Electric resistance; Insulation testing; Polyethylene; Polymers; Stress; Temperature; Trees - insulation;
fLanguage :
English
Journal_Title :
Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9367
Type :
jour
DOI :
10.1109/14.142713
Filename :
142713
Link To Document :
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