• DocumentCode
    797466
  • Title

    Current-acceleration for rapid time-to-failure determination of bipolar junction transistors under emitter-base reverse-bias stress

  • Author

    Neugroschel, Arnost ; Sah, Chih-Tang ; Carroll, Michael S.

  • Author_Institution
    Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
  • Volume
    42
  • Issue
    7
  • fYear
    1995
  • fDate
    7/1/1995 12:00:00 AM
  • Firstpage
    1380
  • Lastpage
    1383
  • Abstract
    An experimental technique is described for accelerated time-to-failure measurement of bipolar junction transistors under low-voltage emitter-base reverse-bias stress. Acceleration of 100 or more can be attained enabling ten-year operating life extrapolation at low operation voltages (⩽3.3 V) in less than 100 hours. The technique, the current acceleration method, exploits the large punch-through current when the collector is shorted to the base during the stress. The technique also provides a means to determine the degradation kinetics and fundamental failure mechanisms at low power supply voltages (3.3 V, 2.5 V, or lower) and low hot carrier kinetic energies
  • Keywords
    bipolar transistors; failure analysis; hot carriers; life testing; semiconductor device reliability; 2.5 V; 3.3 V; accelerated time-to-failure measurement; bipolar junction transistors; current acceleration method; degradation kinetics; emitter-base reverse-bias stress; fundamental failure mechanisms; hot carrier kinetic energies; operating life extrapolation; operation voltages; power supply voltages; punch-through current; rapid time-to-failure determination; Acceleration; Degradation; Extrapolation; Failure analysis; Hot carriers; Kinetic energy; Kinetic theory; Low voltage; Power supplies; Stress measurement;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.391226
  • Filename
    391226