DocumentCode
797466
Title
Current-acceleration for rapid time-to-failure determination of bipolar junction transistors under emitter-base reverse-bias stress
Author
Neugroschel, Arnost ; Sah, Chih-Tang ; Carroll, Michael S.
Author_Institution
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
Volume
42
Issue
7
fYear
1995
fDate
7/1/1995 12:00:00 AM
Firstpage
1380
Lastpage
1383
Abstract
An experimental technique is described for accelerated time-to-failure measurement of bipolar junction transistors under low-voltage emitter-base reverse-bias stress. Acceleration of 100 or more can be attained enabling ten-year operating life extrapolation at low operation voltages (⩽3.3 V) in less than 100 hours. The technique, the current acceleration method, exploits the large punch-through current when the collector is shorted to the base during the stress. The technique also provides a means to determine the degradation kinetics and fundamental failure mechanisms at low power supply voltages (3.3 V, 2.5 V, or lower) and low hot carrier kinetic energies
Keywords
bipolar transistors; failure analysis; hot carriers; life testing; semiconductor device reliability; 2.5 V; 3.3 V; accelerated time-to-failure measurement; bipolar junction transistors; current acceleration method; degradation kinetics; emitter-base reverse-bias stress; fundamental failure mechanisms; hot carrier kinetic energies; operating life extrapolation; operation voltages; power supply voltages; punch-through current; rapid time-to-failure determination; Acceleration; Degradation; Extrapolation; Failure analysis; Hot carriers; Kinetic energy; Kinetic theory; Low voltage; Power supplies; Stress measurement;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.391226
Filename
391226
Link To Document