• DocumentCode
    797735
  • Title

    Wireless micromachined ceramic pressure sensor for high-temperature applications

  • Author

    Fonseca, Michael A. ; English, Jennifer M. ; Von Arx, Martin ; Allen, Mark G.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    11
  • Issue
    4
  • fYear
    2002
  • fDate
    8/1/2002 12:00:00 AM
  • Firstpage
    337
  • Lastpage
    343
  • Abstract
    In high-temperature applications, such as pressure sensing in turbine engines and compressors, high-temperature materials and data retrieval methods are required. The microelectronics packaging infrastructure provides high-temperature ceramic materials, fabrication tools, and well-developed processing techniques that have the potential for applicability in high-temperature sensing. Based on this infrastructure, a completely passive ceramic pressure sensor that uses a wireless telemetry scheme has been developed. The passive nature of the telemetry removes the need for electronics, power supplies, or contacts to withstand the high-temperature environment. The sensor contains a passive LC resonator comprised of a movable diaphragm capacitor and a fixed inductor, thereby causing the sensor resonant frequency to be pressure-dependent. Data is retrieved with an external loop antenna. The sensor has been fabricated and characterized and was compared with an electromechanical model. It was operated up to 400°C in a pressure range from 0 to 7 Bar. The average sensitivity and accuracy of three typical sensors are: -141 kHz Bar-1 and 24 mbar, respectively.
  • Keywords
    capacitive sensors; ceramics; high-temperature techniques; hybrid integrated circuits; microsensors; pressure sensors; radiotelemetry; 0 to 7 bar; 400 C; LTCC fabrication technology; accuracy; average sensitivity; capacitive sensor; ceramic green tape; compressors; data retrieval methods; electromechanical model; external loop antenna; fixed inductor; high-temperature applications; high-temperature ceramic materials; low-temperature cofireable ceramic; microelectronics packaging infrastructure; movable diaphragm capacitor; passive LC resonator; passive ceramic pressure sensor; pressure sensing; screen printing; sensor resonant frequency pressure dependence; turbine engines; wireless micromachined ceramic pressure sensor; wireless telemetry scheme; Capacitive sensors; Ceramics; Compressors; Electromechanical sensors; Engines; Information retrieval; Sensor phenomena and characterization; Telemetry; Turbines; Wireless sensor networks;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.800939
  • Filename
    1022845