Title :
Humidity and reflow resistance of flip chip on foil assemblies with conductive adhesive joints
Author :
De Vries, J. Hans ; Janssen, Esther
Author_Institution :
Philips Centre for Ind. Technol., Eindhoven, Netherlands
Abstract :
The drive toward new first level interconnection technologies is running in parallel with the need to study their reliability as such, as well as in further processes such as second level reflow soldering. Both material properties and process settings have a significant effect on the reliability of adhesive interconnections of flip chips on flexible foil substrates. Integrated circuits (ICs) with pitches of 200 and 300 μm bonded on two different foil types were subjected to various moisture preconditioning treatments, and subsequently reflow soldered. Measurements of the daisy chain resistance are used to monitor the yield before and after reflow testing, and to qualify the endurance behavior in the 85°C/85% RH stress test. We address here the possible failure mechanisms.
Keywords :
adhesives; circuit reliability; failure analysis; flip-chip devices; foils; humidity; integrated circuit bonding; integrated circuit interconnections; moisture; reflow soldering; 200 micron; 300 micron; 85 degC; adhesive interconnections; conductive adhesive; daisy chain resistance; endurance behavior; failure mechanisms; first level interconnection technologies; flexible foil substrates; flip chips; material properties; moisture preconditioning treatments; process settings; reflow soldering; second level reflow soldering; Assembly; Conductive adhesives; Flip chip; Humidity; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit technology; Material properties; Materials reliability; Reflow soldering;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.817647