DocumentCode :
798711
Title :
Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks
Author :
Qu, Weilin ; Mudawar, Issam
Author_Institution :
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
Volume :
26
Issue :
3
fYear :
2003
Firstpage :
598
Lastpage :
609
Abstract :
This paper explores several issues important to the thermal design of single-phase and two-phase micro-channel heat sinks. The first part of the paper concerns single-phase heat transfer in rectangular micro-channels. Experimental results are compared with predictions based on both numerical as well as fin analysis models. While the best agreement between predictions and experimental results was achieved with numerical simulation, a few of the fin models are found to provide fairly accurate predictions. The second part of the paper focuses on predicting the incipient boiling heat flux. A comprehensive model based on bubble departure and superheat criteria is developed and validated with experimental data. The incipience model is capable of predicting the location, shape and size of bubbles departing in rectangular micro-channels. In the third part of the study, an analytical model is developed to predict pressure drop across a two-phase micro-channel heat sink. This model provides a detailed assessment of pressure drop concerns with two-phase micro-channels, including compressibility, flashing and choking. Overall, the present study provides important guidelines concerning practical implementation of micro-channel heat sinks in high-heat-flux electronic cooling applications.
Keywords :
boiling; bubbles; cooling; heat sinks; packaging; bubble departure; choking; compressibility; electronic cooling applications; fin analysis models; flashing; incipient boiling heat flux; pressure drop; rectangular micro-channels; single-phase micro-channel heat sinks; superheat criteria; thermal design methodology; two-phase micro-channel heat sinks; Design methodology; Drag; Electronics cooling; Heat sinks; Heat transfer; Numerical simulation; Predictive models; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2003.817652
Filename :
1234918
Link To Document :
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