DocumentCode :
798795
Title :
Prediction of rate-independent constitutive behavior of Pb-free solders based on first principles
Author :
Sharma, P. ; Ganti, S. ; Dasgupta, A. ; Loman, J.
Author_Institution :
R&D Dept., Gen. Electr. Corp., Niskayuna, NY, USA
Volume :
26
Issue :
3
fYear :
2003
Firstpage :
659
Lastpage :
666
Abstract :
This paper presents a methodology for the theoretical estimation of rate-independent plastic constitutive properties of Pb-free solders using three approaches. The first approach is based on a nonlinear effective medium theory (NEMT) that is scale independent. The second approach is based on the micromechanics and physics of plastic slip in heterogeneous alloys (henceforth called the physical model). This approach explicitly includes microstructural features such as grain size, particle size etc. The third approach is a combination of NEMT and the physical model. Our estimates involve no adjustable calibration parameters and are based on first principles and constituent properties. Parametric studies are conducted to show that the physical model is more effective for small particles sizes (nanoscale <100 nm), small particle spacing (∼ nm range) and low volume fractions (<2.5%); while NEMT performs well for large volume fractions (>5%), large particle sizes (micron size) and large particle spacing (micron scale). The proposed hybrid approach, however, appears to be valid for a wider range of particle sizes and volume fractions. Limited comparison with experimental data is also made and implications of our work in the economical design of novel Pb-free solders is discussed.
Keywords :
grain size; particle size; slip; soldering; viscoplasticity; 0 to 100 nm; Pb-free solders; grain size; micromechanics; nonlinear effective medium theory; particle size; plastic constitutive properties; plastic slip; rate-independent constitutive behavior; volume fractions; Alloying; Capacitive sensors; Estimation theory; Parametric study; Physics; Plastics; Predictive models; Residual stresses; Testing; Thermal stresses;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2003.817861
Filename :
1234925
Link To Document :
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