DocumentCode :
799059
Title :
Nondestructive measurement of complex permittivity and permeability using multilayered coplanar waveguide structures
Author :
Kang, Byoungjoong ; Cho, Jeiwon ; Cheon, Changyul ; Kwon, Youngwoo
Author_Institution :
Center for Millimeter-Wave Integrated Syst., Seoul Nat. Univ., South Korea
Volume :
15
Issue :
5
fYear :
2005
fDate :
5/1/2005 12:00:00 AM
Firstpage :
381
Lastpage :
383
Abstract :
A method for simultaneous measurement of both complex permeability and permittivity is presented using a multilayered conductor-backed coplanar waveguide (MCBCPW) structure to evaluate the possibility of MCBCPW as a sensor for nondestructive electromagnetic measurement. Formulae and methods are developed to extract the electromagnetic parameters of material under test (MUT) placed on the topside of CPW. The measurement results for magnetic powder on MCBCPW sensor showed good agreement with those using coaxial sensors. The method allows both permittivity and permeability to be measured in a single-step measurement without modifying or reshaping the material, making this method particularly attractive for inhomogeneous materials such as biological materials.
Keywords :
coplanar waveguides; magnetic permeability measurement; magnetic sensors; microwave measurement; nondestructive testing; permittivity measurement; MCBCPW sensor; biological materials; coaxial sensors; complex permittivity; inhomogeneous materials; magnetic powder; material under test; multilayered conductor-backed coplanar waveguide; multilayered coplanar waveguide structures; nondestructive electromagnetic measurement; permeability; single-step measurement; Biological materials; Biosensors; Coplanar waveguides; Electromagnetic measurements; Electromagnetic waveguides; Magnetic materials; Magnetic sensors; Particle measurements; Permeability measurement; Permittivity measurement; Coplanar waveguide; multilayer; nondestructive measurement; permeability; single sample;
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2005.847738
Filename :
1427750
Link To Document :
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