Title :
Three-Dimensional Flexible Thermal Sensor for Intravascular Flow Monitoring
Author :
Rui Tang ; Hai Huang ; Yong Mo Yang ; Oiler, Jonathon ; Mengbing Liang ; Hongyu Yu
Author_Institution :
Sch. of Electr., Comput. & Energy Eng., Arizona State Univ., Tempe, AZ, USA
Abstract :
A novel design and assembly technology is developed for a three-dimensional (3-D) flexible thermal flow sensor based on convective heat transfer to reduce detection error caused by position variation of a sensor inside the flow of narrow and curved geometries, such as coronary artery. The 3-D sensor has three independent sensing elements equally distributed around the catheter tube. This arrangement introduces three independent information channels, and cross-comparisons are used to provide accurate flow measurement. The resistance of the sensing elements is measured at ~ 1-1.2 kΩ with the temperature coefficient of resistance at 0.086%/°C. Using a constant-current circuit, the three sensing elements are heated to ~ 10°C above ambient temperature. Flow testing is implemented in a pipe channel at two positions: on the wall and along the center line. Experimental results from these two positions are discussed and computational fluid dynamic simulation based on Newtonian fluid properties is implemented, showing comparable results within an acceptable range of experimental to simulation errors. Therefore, we demonstrate the capability of 3-D thermal flow sensor for detecting the position of the catheter in the flow channel, thereby providing an accurate flow measurement.
Keywords :
channel flow; computational fluid dynamics; convection; flow measurement; flow sensors; pipe flow; temperature sensors; 3D flexible thermal flow sensor; Newtonian fluid properties; catheter tube; convective heat transfer; coronary artery; curved geometries; flow channel; flow measurement; flow testing; intravascular flow monitoring; narrow geometries; pipe channel; temperature 10 degC; temperature coefficient; three-dimensional flexible flexible thermal flow sensor; 3-D packaging; Micro-electro-mechanical systems (MEMS) thermal sensors; polymer; shear stress;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2013.2264623