Embedded solid State heat extraction in integrated power electronic modules

Author

Dirker, Jaco ; Liu, Wenduo ; Van Wyk, Jacobus Daniel ; Malan, Arnaud G. ; Meyer, Josua P.

Author_Institution

Dept. of Mech. & Aeronaut. Eng., Univ. of Pretoria, South Africa

Volume

20

Issue

3

fYear

2005

fDate

5/1/2005 12:00:00 AM

Firstpage

694

Lastpage

703

Abstract

The use of embedded solid-state heat extractors to increase the power densities in power electronic modules seems promising. Cross-sectional geometric optimization was done on heat extraction insert and it was found that the most suitable heat extraction configuration for the dimensional range applicable in power electronics is the use of flat continuous heat extraction layers aiding in conducting heat to externally mounted heat sinks. Theoretically expected thermal enhancement factors were determined and experimentally verified. The adverse influence of interfacial thermal resistances on the effectiveness of heat extraction inserts was also evaluated.

Keywords

heat sinks; optimisation; power electronics; thermal resistance; cross-sectional geometric optimization; embedded solid state heat extraction; externally mounted heat sinks; integrated power electronic modules; interfacial thermal resistance; power density; solid-state heat extractors; Africa; Electronics cooling; Frequency; Heat sinks; Heat transfer; Magnetic materials; Power electronics; Solid state circuits; Thermal conductivity; Thermal resistance; Cross-sectional geometric optimization; embedded solid-state heat extractors; externally mounted heat sinks;

fLanguage

English

Journal_Title

Power Electronics, IEEE Transactions on

Publisher

ieee

ISSN

0885-8993

Type

jour

DOI

10.1109/TPEL.2005.846532

Filename

1427828