Title :
Embedded solid State heat extraction in integrated power electronic modules
Author :
Dirker, Jaco ; Liu, Wenduo ; Van Wyk, Jacobus Daniel ; Malan, Arnaud G. ; Meyer, Josua P.
Author_Institution :
Dept. of Mech. & Aeronaut. Eng., Univ. of Pretoria, South Africa
fDate :
5/1/2005 12:00:00 AM
Abstract :
The use of embedded solid-state heat extractors to increase the power densities in power electronic modules seems promising. Cross-sectional geometric optimization was done on heat extraction insert and it was found that the most suitable heat extraction configuration for the dimensional range applicable in power electronics is the use of flat continuous heat extraction layers aiding in conducting heat to externally mounted heat sinks. Theoretically expected thermal enhancement factors were determined and experimentally verified. The adverse influence of interfacial thermal resistances on the effectiveness of heat extraction inserts was also evaluated.
Keywords :
heat sinks; optimisation; power electronics; thermal resistance; cross-sectional geometric optimization; embedded solid state heat extraction; externally mounted heat sinks; integrated power electronic modules; interfacial thermal resistance; power density; solid-state heat extractors; Africa; Electronics cooling; Frequency; Heat sinks; Heat transfer; Magnetic materials; Power electronics; Solid state circuits; Thermal conductivity; Thermal resistance; Cross-sectional geometric optimization; embedded solid-state heat extractors; externally mounted heat sinks;
Journal_Title :
Power Electronics, IEEE Transactions on
DOI :
10.1109/TPEL.2005.846532
