DocumentCode :
800913
Title :
Dielectrically-bonded long wavelength vertical cavity laser on GaAs substrates using strain-compensated multiple quantum wells
Author :
Chua, C.L. ; Lin, C.H. ; Zhu, Z.H. ; Lo, Y.H. ; Hong, Mingyi ; Mannaerts, J.P. ; Bhat, R.
Author_Institution :
Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
Volume :
6
Issue :
12
fYear :
1994
Firstpage :
1400
Lastpage :
1402
Abstract :
We present a novel low temperature bonding technique for fabricating long wavelength vertical cavity surface emitting lasers (VCSEL´s). The technique relies on a 750 /spl Aring/-thick intermediate spin-on glass layer to join a highly efficient InP-based InGaAs-InGaAsP strain-compensated multiple quantum well (SC-MQW) gain medium on a GaAs substrate. We fabricated the device on GaAs in order to take advantage of highly reflective AlAs-GaAs Bragg reflectors. The optically-pumped device has a low threshold pump power of 4.2 kW/cm2 at room temperature and operates at a wavelength of 1.44 μm.
Keywords :
III-V semiconductors; distributed Bragg reflector lasers; gallium arsenide; gallium compounds; indium compounds; laser cavity resonators; optical fabrication; optical pumping; quantum well lasers; surface emitting lasers; wafer bonding; 1.44 mum; 750 A; AlAs-GaAs; GaAs; GaAs substrates; InGaAs-InGaAsP; InP-based InGaAs-InGaAsP strain-compensated multiple quantum well; dielectrically-bonded long wavelength vertical cavity laser; gain medium; highly reflective AlAs-GaAs Bragg reflectors; intermediate spin-on glass layer; low temperature bonding technique; low threshold pump power; optically-pumped device; room temperature; strain-compensated multiple quantum wells; Bonding; Dielectrics; Gallium arsenide; Optical devices; Optical surface waves; Quantum well lasers; Surface emitting lasers; Surface waves; Temperature; Vertical cavity surface emitting lasers;
fLanguage :
English
Journal_Title :
Photonics Technology Letters, IEEE
Publisher :
ieee
ISSN :
1041-1135
Type :
jour
DOI :
10.1109/68.392231
Filename :
392231
Link To Document :
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