DocumentCode
80245
Title
Saliency-Based Defect Detection in Industrial Images by Using Phase Spectrum
Author
Xiaolong Bai ; Yuming Fang ; Weisi Lin ; Lipo Wang ; Bing-Feng Ju
Author_Institution
State Key Lab. of Fluid Power Transm. & Control, Zhejiang Univ., Hangzhou, China
Volume
10
Issue
4
fYear
2014
fDate
Nov. 2014
Firstpage
2135
Lastpage
2145
Abstract
For computer vision-based inspection of electronic chips or dies in semiconductor production lines, we propose a new method to effectively and efficiently detect defects in images. Different from the traditional methods that compare the image of each test chip or die with the template image one by one, which are sensitive to misalignment between the test and template images, a collection of multiple test images are used as the input image for processing simultaneously in our method with two steps. The first step is to obtain salient regions of the whole collection of test images, and the second step is to evaluate local discrepancy between salient regions in test images and the corresponding regions in the defect-free template image. To be more specific, in the first step of our method, phase-only Fourier transform (POFT), which is computationally efficient for online applications in industry, is used for saliency detection. We provide the theoretical justification for POFT to be effective to attenuate the normal regions and amplify the defects in multiple test images, which are usually arranged in a matrix format in industrial practice. By comparing with four other popular methods, the proposed algorithm can efficiently accommodate small variations (inevitable in practice) in test chips or dies, such as the spatial misalignments and product variations. Experimental results on a large-scale database including 1073 images, 94 of which are defective, show that our method performs much better than the other methods in terms of precision, recall, and F-measure.
Keywords
computer vision; production engineering computing; semiconductor industry; F-measure; POFT; computer vision-based inspection; defect-free template image; dies; electronic chips; industrial images; industrial practice; large-scale database; matrix format; phase spectrum; phase-only Fourier transform; product variations; saliency detection; saliency-based defect detection; semiconductor production lines; test chip; Algorithm design and analysis; Computer vision; Feature extraction; Fourier transforms; Inspection; Computer vision; Fourier transform; defect detection; phase spectrum; saliency; surface defects; template matching;
fLanguage
English
Journal_Title
Industrial Informatics, IEEE Transactions on
Publisher
ieee
ISSN
1551-3203
Type
jour
DOI
10.1109/TII.2014.2359416
Filename
6906292
Link To Document