DocumentCode
802659
Title
Foreword Special issue on mems/nems packaging
Author
Lee, Y.C. ; Chen, S. ; Jung, Edward
Author_Institution
University of Colorado
Volume
26
Issue
3
fYear
2003
Firstpage
215
Lastpage
216
Keywords
Aging; Electronic packaging thermal management; Electronics packaging; Manufacturing; Mechanical engineering; Micromechanical devices; Nanoelectromechanical systems; Paper technology; USA Councils; Wafer scale integration;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2003.817823
Filename
1236519
Link To Document