Title :
Foreword Special issue on mems/nems packaging
Author :
Lee, Y.C. ; Chen, S. ; Jung, Edward
Author_Institution :
University of Colorado
Keywords :
Aging; Electronic packaging thermal management; Electronics packaging; Manufacturing; Mechanical engineering; Micromechanical devices; Nanoelectromechanical systems; Paper technology; USA Councils; Wafer scale integration;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2003.817823
