• DocumentCode
    803544
  • Title

    Colloidal processing of polymer ceramic nanocomposite integral capacitors

  • Author

    Windlass, Hitesh ; Raj, P. Markondeya ; Balaraman, Devarajan ; Bhattacharya, Swapan K. ; Tummala, Rao R.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    26
  • Issue
    2
  • fYear
    2003
  • fDate
    4/1/2003 12:00:00 AM
  • Firstpage
    100
  • Lastpage
    105
  • Abstract
    Polymer ceramic composites form a suitable material system for low temperature fabrication of embedded capacitors appropriate for the MCM-L technology. Improved electrical properties such as permittivity can be achieved by efficient filling of polymers with high dielectric constant ceramic powders such as lead magnesium niobate-lead titanate (PMN-PT) and barium titanate (BT). Photodefinable epoxies as the matrix polymer allow fine feature definition of the capacitor elements by conventional lithography techniques. The optimum weight percent of dispersant is tuned by monitoring the viscosity of the suspension. The dispersion mechanism (steric and electrostatic contribution) in a slightly polar solvent such as propylene glycol methyl ether acetate (PGMEA) is investigated from electrophoretic measurements. A high positive zeta potential is observed in the suspension, which suggests a strong contribution of electrostatic stabilization. By optimizing the particle packing using a bimodal distribution and modified processing methodology, a dielectric constant greater than 135 was achieved in PMN-PT/epoxy system. Suspensions are made with the lowest PGMEA content to ensure the efficiency of the dispersion and efficient particle packing in the dried film. Improved colloidal processing of nanoparticle-filled epoxy is a promising method to obtain ultra-thin capacitor films (<2μm) with high capacitance density and improved yield. Capacitance of 35 nF/cm2 was achieved with the thinnest films (2.5-3.0 μm).
  • Keywords
    ceramic capacitors; colloids; dielectric thin films; electrostatics; filled polymers; integrated circuit manufacture; multichip modules; nanocomposites; permittivity; powders; stability; thin film capacitors; 2.5 to 3.0 micron; BaTiO3; MCM-L technology; PGMEA; PMN-PT; PMN-PT/epoxy system; PbMnNbO3; PbTiO3; bimodal distribution; colloidal processing; conventional lithography techniques; electrical properties; electrophoretic measurements; electrostatic stabilization; embedded capacitors; high capacitance density; high dielectric constant ceramic powders; high positive zeta potential; low temperature fabrication; matrix polymer; modified processing methodology; nanoparticle-filled epoxy; particle packing; permittivity; photodefinable epoxies; polymer ceramic integral capacitors; polymer ceramic nanocomposite; propylene glycol methyl ether acetate; ultra-thin capacitor films; Capacitance; Capacitors; Ceramics; Composite materials; Dielectric materials; Electrostatics; Fabrication; Polymers; Temperature; Titanium compounds;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2003.817719
  • Filename
    1236873