Title :
Novel techniques for millimeter-wave packages
Author :
Herman, Martin I. ; Lee, Karen A. ; Kolawa, Elzbieta A. ; Lowry, Lynn E. ; Tulintseff, N.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fDate :
7/1/1995 12:00:00 AM
Abstract :
A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC´s) and multichip module (MCM) applications. It has low-loss wideband RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost. Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite-difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883
Keywords :
MIMIC; cooling; finite difference time-domain analysis; integrated circuit packaging; millimetre wave transistors; multichip modules; seals (stoppers); semiconductor device packaging; block copolymer coatings; discrete devices; electromagnetic analysis; finite-difference time-domain algorithm; hermetic sealing; manufacturing tolerances; millimeter-wave packages; monolithic microwave integrated circuits; multichip module; package architecture; surface finishes; thermal management; wideband RF transitions; Application specific integrated circuits; Electromagnetic analysis; Finite difference methods; Integrated circuit packaging; Materials science and technology; Microwave devices; Millimeter wave integrated circuits; Millimeter wave technology; Thermal management; Time domain analysis;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on